SiC Wafer Dislocation Defect Inspection

SiC Wafer Dislocation Defect Inspection

This system adopts advanced optical imaging and intelligent-analysis technology to accurately identify and locate micropipes and dislocations in SiC wafers. It offers high precision, speed, and automation, supporting non-contact fast scanning with excellent accuracy and throughput. It effectively ensures SiC material quality and reliability and is suitable for both R&D and mass-production environments, serving as a key tool for third-generation semiconductor manufacturing quality control.

AOI Inspection

AOI Inspection

Wafer Inspection

Wafer Inspection

Non-Contact NDT

Non-Contact NDT

Defect Recognition

Defect Recognition

+86   0571-88912732
+86   0571-88912732