SiC Wafer Dislocation Defect Inspection
This system adopts advanced optical imaging and intelligent-analysis technology to accurately identify and locate micropipes and dislocations in SiC wafers. It offers high precision, speed, and automation, supporting non-contact fast scanning with excellent accuracy and throughput. It effectively ensures SiC material quality and reliability and is suitable for both R&D and mass-production environments, serving as a key tool for third-generation semiconductor manufacturing quality control.
AOI Inspection
Wafer Inspection
Non-Contact NDT
Defect Recognition
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