White-Light Interferometry
Based on multi-beam reflective optical-interference principles, this system performs non-contact, non-destructive, nanometer-level thickness measurement of transparent and semi-transparent materials. It integrates a light source, fiber, mounting frame, and spectrometer, supporting thickness detection from 1 nm to 70 µm at normal incidence (0°) with 1 nm accuracy. The platform provides high-speed, high-stability measurements, adaptable to multilayer films and coated materials. It is widely used for wafer films, optical films, lithium separators, and coating films in high-end manufacturing environments.
White-Light Interferometry
Thickness Measurement
Non-Contact NDT
Film Materials
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