AOI Wafer Defect Inspection
Utilizing microscopic imaging combined with AI algorithms, this AOI system provides high-resolution, non-contact defect inspection for semiconductor wafers. Equipped with a self-developed line-scan camera supporting bright/dark-field dual modes, it accommodates 6–12 inch Si, SiC, and GaAs wafers. Based on Golden Die and Die-to-Die comparison with AI classification models, it detects particles, scratches, probe marks, cracks, residual glue, and pattern bridging. The platform integrates EFEM loading/unloading and pre-alignment modules, a high-precision XYZ stage, and an optical subsystem supporting OCR recognition, wafer-map management, auto-focus, defect review, and report export. Detection repeatability reaches ≥ 98 %, ensuring process quality control between production nodes.
AOI Inspection
AI Algorithms
Defect Recognition
Wafer Inspection
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